Concepedia

Ray Gerke

RG

Statistics

Publications

3

Citations

62

H-Index

3

Active since

1995

Affiliations

Motorola (United States)(Current)

Ray Gerke is an author at Motorola (United States) specializing in electrical engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical Engineering3D PrintingComputer EngineeringComputer ArchitectureReliabilityMicrostructureNanoelectronics

Publications per year

1995–1999

3

Publications

3

A hi-density C4/CBGA interconnect technology for a CMOS microprocessor

G.B. Kromann, Ray Gerke, Wayne Wei-Xi Huang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 31 citations

Risc Cmos Microprocessor, Electrical Engineering, Controlled-collapse Chip Connection +15

Reliability comparison of two metallurgies for ceramic ball grid array

Donald R. Banks, Terry Burnette, Ray Gerke et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1995 · 18 citations

Relative Fatigue Behavior, Engineering, Integrated Circuits +16

Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors

Ray Gerke, G.B. Kromann · IEEE Transactions on Components and Packaging Technologies · 1999 · 13 citations

Ceramic Quad-flat-packs, Engineering, Recent Trends +21

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