Concepedia

Xiang Dai

XD

17

Publications

703

Citations

15

H-Index

1996

Active since

Affiliations

The University of Texas at Austin(Current)

Hewlett-Packard (United States)

Southern Illinois University Carbondale

Nanjing Forestry University

Xiang Dai is an author at The University of Texas at Austin specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsMaterial ScienceMicroelectronicsMechanicsApplied PhysicsSolid MechanicsMicrofabrication

Publications per year

1996–2020

17

Publications

17

Gear tooth mesh stiffness: A comparison of calculation approaches

Christopher G. Cooley, Chunguang Liu, Xiang Dai et al. · Mechanism and Machine Theory · 2016 · 165 citations

Engineering, Mechanics, Mechanical Engineering +6

Reliability issues for flip-chip packages

Paul S. Ho, Guotao Wang, Min Ding et al. · Microelectronics Reliability · 2004 · 79 citations

Reliability, Hardware Security, Reliability Issues +9

Adhesion measurement for electronic packaging applications using double cantilever beam method

Xiang Dai, M. Brillhart, Paul S. Ho · IEEE Transactions on Components and Packaging Technologies · 2000 · 66 citations

Interface Integrity, Engineering, Mechanical Engineering +18

Effects of low temperature and low irradiance on the physiological characteristics and related gene expression of different pepper species

Lijun Ou, Gang Wei, Z. Q. Zhang et al. · Photosynthetica · 2014 · 63 citations · Full text

Plant Physiology, Engineering, Botany +18

Dynamic tooth root strains and experimental correlations in spur gear pairs

Xiang Dai, Christopher G. Cooley, Robert G. Parker · Mechanism and Machine Theory · 2016 · 48 citations

Experimental Correlations, Root Strains, Mechanical Engineering +3

Rows per page

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