Concepedia

Min Ding

MD

16

Publications

609

Citations

13

H-Index

2003

Active since

Affiliations

The University of Texas at Austin(Current)

Motorola (United States)

Fujian University of Technology

Fujian Normal University

Advanced Semiconductor Engineering (Taiwan)

Min Ding is an author at The University of Texas at Austin specializing in engineering, materials science, and microstructure.

Top concepts

EngineeringMaterial ScienceMicrostructureElectronic PackagingMicroelectronicsMaterials EngineeringMechanical EngineeringCorrosionElectrical EngineeringApplied Physics

Publications per year

2003–2022

16

Publications

16

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Brook Chao, Seung‐Hyun Chae, Xuefeng Zhang et al. · Journal of Applied Physics · 2006 · 121 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Effect of contact metallization on electromigration reliability of Pb-free solder joints

Min Ding, Guotao Wang, Brook Chao et al. · Journal of Applied Physics · 2006 · 80 citations

Engineering, Mechanical Engineering, Solder Bump +18

Reliability issues for flip-chip packages

Paul S. Ho, Guotao Wang, Min Ding et al. · Microelectronics Reliability · 2004 · 79 citations

Reliability, Hardware Security, Reliability Issues +9

Multi-functional and integrated actuators made with bio-inspired cobweb carbon nanotube–Polymer composites

Mingcen Weng, Min Ding, Peidi Zhou et al. · Chemical Engineering Journal · 2022 · 50 citations

Materials Science, Engineering, Carbon-based Material +10

Achieving high reliability low cost lead-free SAC solder joints via Mn or Ce doping

Weiping Liu, Ning-Cheng Lee, Adriana Porras et al. · 2009 · 43 citations

Materials Engineering, Materials Science, Electrical Engineering +15

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