Shock impact reliability characterization of a handheld product in accelerated tests and use environment

Impact life prediction modeling of TFBGA packages under board level drop test

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Architecture, Computer Engineering, Packaging Design +11

Effect of the drop impact on BGA/CSP package reliability

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Engineering, Computer Engineering, Packaging Design +11

Drop impact survey of portable electronic products

Chwee Teck Lim, C.W. Ang, Long Bin Tan et al. · 2004 · 102 citations

Natural Sciences, Electrical Engineering, Mechanical Behavior Of Materials +16

Modal analysis and dynamic responses of board level drop test

Jing-en Luan, Tong Yan Tee, E. Pek et al. · 2004 · 90 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Investigating the drop impact of portable electronic products

Yin-Yi Low · 2003 · 89 citations

Engineering, Electrical Engineering, Mechanical Behavior Of Materials +16