Concepedia
Microelectronics Reliability · 2010 · 49 citations · 11 references
Electrical EngineeringEngineeringPower DevicePwm PowerBias Temperature InstabilityPower Semiconductor DeviceHigh Ambient TemperaturePower Electronic SystemsPower ElectronicsDevice Reliability
11
Selected failure mechanisms of modern power modules
Mauro Ciappa · Microelectronics Reliability · 2002 · 955 citations
Reliability, Electrical Engineering, Reliability Engineering +6
On the effect of power cycling stress on IGBT modules
P. Cova, F. Fantini · Microelectronics Reliability · 1998 · 81 citations
Electrical Engineering, Engineering, Power Device +3
Degradation behavior of 600V–200A IGBT modules under power cycling and high temperature environment conditions
Mohamed Elkarim Bouarroudj, Zoubir Khatir, J.P. Ousten et al. · Microelectronics Reliability · 2007 · 75 citations · Full text
Electrical Engineering, Power Cycling, Engineering +9
Fast power cycling test for insulated gate bipolar transistor modules in traction application
Martin Held, P. Jacob, G. Nicoletti et al. · International Journal of Electronics · 1999 · 75 citations
Engineering, Descriptive Model, Traction Application +16
Advanced IGBT modules for railway traction applications: Reliability testing
H. Berg, E. Wolfgang · Microelectronics Reliability · 1998 · 63 citations
Reliability, Advanced Igbt Modules, Electrical Engineering +6