High density of electrodeposited Sn/Ag bumps for flip chip connection

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations

Engineering, Electrical Engineering, Materials Engineering +14

Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints

S. Choi, J. P. Lucas, K. N. Subramanian et al. · Journal of Materials Science Materials in Electronics · 2000 · 63 citations

Natural Sciences, Materials Engineering, Materials Science +15

Eutectic Sn-Ag solder bump process for ULSI flip chip technology

H. Ezawa, Masahiro Miyata, S. Honma et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 38 citations

Engineering, Materials Engineering, Materials Science +14

Characterisation of electroplated Sn/Ag solder bumps

Montserrat Bigas, E. Cabruja · Microelectronics Journal · 2005 · 31 citations

Engineering, Electrical Engineering, Materials Engineering +14

Development and validation of a lead-free alloy for solder paste applications

T. Laine-Ylijoki, H. Steen, Atso Forstén · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1997 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +12