Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 275 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +14

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Natural Sciences, Materials Engineering, Materials Science +17

The growth of Cu-Sn intermetallics at a pretinned copper-solder interface

A.J. Sunwoo, J. W. Morris, George K. Lucey · Metallurgical Transactions A · 1992 · 176 citations

Natural Sciences, Materials Engineering, Materials Science +12

The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints

Wenge Yang, L.E. Felton, Robert W. Messler · Journal of Electronic Materials · 1995 · 151 citations

Natural Sciences, Materials Engineering, Materials Science +13