Concepedia

H. Ezawa

HE

Statistics

Publications

2

Citations

50

H-Index

2

Active since

2001

Affiliations

Toshiba (Japan)(Current)

H. Ezawa is an author at Toshiba (Japan) specializing in manufacturing processes, semiconductor devices, and electronic materials.

Publications per year

2001–2002

2

Publications

2

Eutectic Sn-Ag solder bump process for ULSI flip chip technology

H. Ezawa, Masahiro Miyata, S. Honma et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2001 · 38 citations

Engineering, Materials Engineering, Materials Science +14

Eutectic solder flip chip technology-bumping and assembly process development for CSP/BGA

Hideo Aoki, C. Takubo, T. Nakazawa et al. · 2002 · 12 citations

Engineering, Materials Engineering, Materials Science +15

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