Concepedia

C. Takubo

CT

Statistics

Publications

4

Citations

93

H-Index

4

Active since

2002

Affiliations

Toshiba (Japan)(Current)

C. Takubo is an author at Toshiba (Japan) specializing in electrical engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMicrofabricationComputer EngineeringMechanical Engineering3D PrintingHeat TransferRefrigeration

Publications per year

2002–2010

4

Publications

4

Silicon interposer technology for high-density package

M. Matsuo, N. Hayasaka, Katsuya Okumura et al. · 2002 · 41 citations

Bump Pitch, Electrical Engineering, Chip-scale Package +13

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Kenji Hirohata, Katsumi Hisano, Minoru MUKAI et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 23 citations

Engineering, Mechanical Engineering, Thermal-stress Analysis +18

Development of 3-dimensional module package, "System Block Module"

Tatsuya Imoto, M. Matsui, C. Takubo et al. · 2002 · 17 citations

Engineering, Computer-aided Design, Flip Chip Bonding +19

Eutectic solder flip chip technology-bumping and assembly process development for CSP/BGA

Hideo Aoki, C. Takubo, T. Nakazawa et al. · 2002 · 12 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15

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