Concepedia

Katsumi Hisano

KH

Statistics

Publications

4

Citations

61

H-Index

4

Active since

2003

Affiliations

Toshiba (Japan)(Current)

Katsumi Hisano is an author at Toshiba (Japan) specializing in engineering, refrigeration, and electronic packaging.

Top concepts

EngineeringHeat TransferRefrigerationThermal ModelingThermal EngineeringElectronic PackagingElectrical EngineeringMicroelectronicsEnergy EfficiencyPower Electronics

Publications per year

2003–2010

4

Publications

4

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Kenji Hirohata, Katsumi Hisano, Minoru MUKAI et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 23 citations

Engineering, Mechanical Engineering, Thermal-stress Analysis +18

Thermal Problem of Next Generation Semiconductor Power Devices

Hideo Iwasaki, Katsumi Hisano, Tomonao Takamatsu · The proceedings of the JSME annual meeting · 2003 · 14 citations · Full text

Engineering, Energy Efficiency, Power Electronic Systems +20

Health-monitoring method of note PC for cooling performance degradation and load assessment

Kenji Hirohata, Katsumi Hisano, Minoru MUKAI · Microelectronics Reliability · 2010 · 13 citations

Engineering, Wearable Technology, Computer Engineering +5

Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation

Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata · 2007 · 11 citations

Engineering, Energy Efficiency, Mechanical Engineering +20

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