Concepedia

Katsumi Hisano

KH

Statistics

Publications

4

Citations

62

H-Index

4

Active since

2003

Affiliations

Toshiba (Japan)(Current)

Katsumi Hisano is an author at Toshiba (Japan) specializing in engineering, heat transfer, and thermal design.

Publications per year

2003–2010

4

Publications

4

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Kenji Hirohata, Katsumi Hisano, Minoru MUKAI et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 24 citations

Engineering, Materials Engineering, Heat Transfer +15

Thermal Problem of Next Generation Semiconductor Power Devices

Hideo Iwasaki, Katsumi Hisano, Tomonao Takamatsu · The proceedings of the JSME annual meeting · 2003 · 14 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Health-monitoring method of note PC for cooling performance degradation and load assessment

Kenji Hirohata, Katsumi Hisano, Minoru MUKAI · Microelectronics Reliability · 2010 · 13 citations

Engineering, Mechanical Engineering, Air Conditioning +16

Robust Thermal Design for Power Device Package Using Response Surface Method and Monte Carlo Simulation

Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata · 2007 · 11 citations

Engineering, Design, Materials Engineering +17

1–4 of 4