Concepedia

Minoru MUKAI

MM

Statistics

Publications

8

Citations

177

H-Index

8

Active since

1995

Affiliations

Toshiba (Japan)(Current)

Minoru MUKAI is an author at Toshiba (Japan) specializing in materials engineering, engineering, and fatigue life prediction.

Publications per year

1995–2010

8

Publications

8

Prediction of Thermal Fatigue Life for Encapsulated Flip Chip Interconnection

Kazuhide Doi, N. Hirano, T. Okada et al. · 1995 · 38 citations

Engineering, Materials Engineering, Materials Science +14

Thermal Fatigue Life of Solder Bumps in BGA.

Minoru MUKAI, Takashi Kawakami, Kuniaki Takahashi et al. · JSME International Journal Series A · 1998 · 37 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Kenji Hirohata, Katsumi Hisano, Minoru MUKAI et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 24 citations

Engineering, Materials Engineering, Heat Transfer +15

Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints

Hiroyuki Takahashi, Takashi Kawakami, Minoru MUKAI et al. · Journal of The Japan Institute of Electronics Packaging · 2004 · 24 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Damage Path Simulation of Solder Joints in QFP

Minoru MUKAI, Kenji Hirohata, Hiroyuki Takahashi et al. · 2005 · 16 citations

Engineering, Electrical Engineering, Materials Engineering +17

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