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Prediction of Thermal Fatigue Life for Encapsulated Flip Chip Interconnection
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1995
Year
Unknown Venue
Electrical EngineeringEngineeringHardware ReliabilityAdvanced Packaging (Semiconductors)Thermal Fatigue LifeComputer EngineeringChip AttachmentThermodynamicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringDevice Reliability
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