Concepedia

T. Nakazawa

TN

Statistics

Publications

3

Citations

56

H-Index

3

Active since

1994

Affiliations

Toshiba (Japan)(Current)

T. Nakazawa is an author at Toshiba (Japan) specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicroelectronicsComputer EngineeringElectrical EngineeringMechanical EngineeringPlasticitySolid MechanicsMicrofabrication

Publications per year

1994–2002

3

Publications

3

Simplified and practical estimation of package cracking during reflow soldering process

K. Sawada, T. Nakazawa, Noriyasu Kawamura et al. · 1994 · 30 citations

Engineering, Mechanical Engineering, Reflow Soldering Process +19

Flip chip underfill reliability of CSP during IR reflow soldering

Y. Ohshima, T. Nakazawa, K. Doi et al. · 2002 · 14 citations

Materials Science, Electrical Engineering, Chip-scale Package +11

Eutectic solder flip chip technology-bumping and assembly process development for CSP/BGA

Hideo Aoki, C. Takubo, T. Nakazawa et al. · 2002 · 12 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15

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