Concepedia
Statistics
Publications
8
Citations
248
H-Index
Active since
1994
Affiliations
Toshiba (Japan)(Current)
National Institute for Materials Science
National Institute of Advanced Industrial Science and Technology
The University of Tokyo
K. Sawada is an author at Toshiba (Japan) specializing in electronic packaging, engineering, and materials science.
Top concepts
EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMaterials EngineeringPlasticityCorrosionApplied PhysicsSolid MechanicsSurface Science
Publications per year
1994–2008
Bumpless Interconnect of 6-$\mu$m-Pitch Cu Electrodes at Room Temperature
Akitsu Shigetou, Toshihiro Itoh, K. Sawada et al. · IEEE Transactions on Advanced Packaging · 2008 · 80 citations
Materials Science, Room Temperature, Electrical Engineering +14
The oxidation control of copper leadframe package for prevention of popcorn cracking
E. Takano, T. Mino, Kenji Takahashi et al. · 2002 · 44 citations
Materials Science, Materials Engineering, Chemical Engineering +15
Package Deformation And Cracking Mechanism Due To Reflow Soldering
K. Sawada · 2005 · 30 citations
Materials Science, Materials Engineering, Chip-scale Package +14
Simplified and practical estimation of package cracking during reflow soldering process
K. Sawada, T. Nakazawa, Noriyasu Kawamura et al. · 1994 · 30 citations
Engineering, Mechanical Engineering, Reflow Soldering Process +19
Bumpless interconnect of 6-μm pitch Cu electrodes at room temperature
Akitsu Shigetou, Toshihiro Itoh, K. Sawada et al. · 2008 · 22 citations
Engineering, Electrode-electrolyte Interface, Cu Electrodes +17
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