Concepedia

Noriyasu Kawamura

NK

Statistics

Publications

5

Citations

115

H-Index

5

Active since

1994

Affiliations

Toshiba (Japan)(Current)

Noriyasu Kawamura is an author at Toshiba (Japan) specializing in electronic packaging, mechanical engineering, and engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMaterial SciencePlasticityApplied PhysicsMicroelectronicsElectrical EngineeringMechanics Of MaterialsMechanics

Publications per year

1994–2002

5

Publications

5

Pressure contact assembly technology of high power devices

Hideo Matsuda, Michiaki Hiyoshi, Noriyasu Kawamura · 2002 · 37 citations

Electrical Engineering, Pressure Contact, Engineering +15

Simplified and practical estimation of package cracking during reflow soldering process

K. Sawada, T. Nakazawa, Noriyasu Kawamura et al. · 1994 · 30 citations

Engineering, Mechanical Engineering, Reflow Soldering Process +19

Mechanical fatigue test method for chip/underfill delamination in flip-chip packages

Kenji Hirohata, Noriyasu Kawamura, M. Mukai et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2002 · 25 citations

Engineering, Mechanical Engineering, Reliability Engineering +20

Development of moisture-proof thin and large QFP with copper lead frame

T. Mino, K. Sawada, A. Kurosu et al. · 2002 · 12 citations

Materials Science, Materials Engineering, Chip-scale Package +14

Adhesion integrity evaluation of plastic encapsulated semiconductor package

Noriyasu Kawamura, Kenji Hirohata, Takashi Kawakami et al. · 2002 · 11 citations

Materials Science, Chip-scale Package, Engineering +11

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