Anisotropic silicon trenches 300–500 μm deep employing time multiplexed deep etching (TMDE)

Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher

Arturo A. Ayón, Rebecca A. Braff, C. C. Lin et al. · Journal of The Electrochemical Society · 1999 · 408 citations

Electrical Engineering, Anisotropic Profiles, Engineering +13

Macro Power from Micro Machinery

Alan H. Epstein, S.D. Senturia · Science · 1997 · 273 citations

Electrical Engineering, Energy Harvesting, Engineering +12

Phenomenological modeling of ion-enhanced surface kinetics in fluorine-based plasma etching

David C. Gray, I. Tepermeister, Herbert H. Sawin · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1993 · 251 citations

Chemical Kinetics, Engineering, Ion-enhanced Surface Kinetics +19

A six-wafer combustion system for a silicon micro gas turbine engine

A. Mehra, Xin Zhang, Arturo A. Ayón et al. · Journal of Microelectromechanical Systems · 2000 · 222 citations

Engineering, Mechanical Engineering, Six-wafer Combustion System +16

Conductance considerations in the reactive ion etching of high aspect ratio features

J. W. Coburn, Harold F. Winters · Applied Physics Letters · 1989 · 182 citations

Engineering, Electron-beam Lithography, Vacuum Device +17