A method for characterizing the pad surface texture and modeling its impact on the planarization in CMP

Contact and Rubbing of Flat Surfaces

J. F. Archard · Journal of Applied Physics · 1953 · 7.7K citations

Engineering, Materials Science, Mechanical Engineering +17

Contact of nominally flat surfaces

J. A. Greenwood, J. B. P. Williamson · Proceedings of the Royal Society of London A Mathematical and Physical Sciences · 1966 · 5.6K citations

Engineering, Materials Science, Surface Engineering +10

The Contact of Two Nominally Flat Rough Surfaces

J. A. Greenwood, J. H. Tripp · Proceedings of the Institution of Mechanical Engineers · 1970 · 1.7K citations

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Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 139 citations

Engineering, Electrical Engineering, Materials Science +16

Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

Dennis O. Ouma, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Semiconductor Manufacturing · 2002 · 136 citations

Engineering, Electrical Engineering, Materials Science +17