Curing kinetics and optimal cure schedules for underfill materials

Modelling the Cure of a Commercial Epoxy Resin for Applications in Resin Transfer Moulding

Panagiotis Karkanas, Ivana K. Partridge, David Attwood · Polymer International · 1996 · 125 citations

Engineering, Chemical Engineering, Materials Engineering +17

Encapsulants used in flip-chip packages

D. Suryanarayana, T. Y. Wu, J.A. Varcoe · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 93 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Sven Rzepka, M. A. Korhonen, E. Meusel et al. · Journal of Electronic Packaging · 1998 · 48 citations

Engineering, Materials Engineering, Materials Science +17

Humidity effects on adhesion strength between solder ball and epoxy underfills

C.E. Park, Bing Han, H. E. Bair · Polymer · 1997 · 43 citations

Architecture, Materials Engineering, Materials Science +15

Cure kinetics and mechanical properties of conductive adhesive

S.X. Wu, C. Zhang, Chao-Pin Yeh et al. · 2002 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +17