Concepedia

S. Chungpaiboonpatana

SC

Statistics

Publications

6

Citations

178

H-Index

6

Active since

1999

Affiliations

Conexant (United States)(Current)

University of California, Irvine

Hiroshima University

S. Chungpaiboonpatana is an author at Conexant (United States) specializing in underfill materials, materials science, and materials engineering.

Publications per year

1999–2012

6

Publications

6

Onset of electrical conduction in isotropic conductive adhesives: a general theory

A. Mikrajuddin, F.G. Shi, S. Chungpaiboonpatana et al. · Materials Science in Semiconductor Processing · 1999 · 59 citations

Natural Sciences, Electrical Engineering, Materials Science +12

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

F.G. Shi, Mikrajuddin Abdullah, S. Chungpaiboonpatana et al. · Materials Science in Semiconductor Processing · 1999 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +15

Packaging of Copper/Low-k IC Devices: A Novel Direct Fine Pitch Gold Wirebond Ball Interconnects Onto Copper/Low-k Terminal Pads

S. Chungpaiboonpatana, F.G. Shi · IEEE Transactions on Advanced Packaging · 2004 · 23 citations

Engineering, Electrical Engineering, Materials Engineering +17

Curing kinetics and optimal cure schedules for underfill materials

David T. Hsu, H.K Kim, F.G. Shi et al. · Microelectronics Journal · 2000 · 16 citations

Engineering, Materials Engineering, Materials Science +16

Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology

J. Tamil, Siew Hoon Ore, Kian Yeow Gan et al. · IMAPSource Proceedings · 2011 · 13 citations · Full text

Arts, Design, Manufacturing Engineering +13

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