Degradation Assessment in IGBT Modules Using Four-Point Probing Approach

Abstract

Four-point probing of electrical parameters on various components of IGBT modules is suggested as an approach for the estimation of degradation in stressed devices. By comparison of these parameters for stressed and new components one can evaluate an overall degradation of the module and find out the wear state of individual components. This knowledge can be applied for preventing early failures and for optimization of the device design. The method is presented by regarding a standard type power module subjected to power cycling.