Kristian Bonderup Pedersen

A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations

Rui Wu, Huai Wang, Kristian Bonderup Pedersen et al. · IEEE Transactions on Industry Applications · 2016 · 118 citations

Dynamic Modeling Method of Electro-Thermo-Mechanical Degradation in IGBT Modules

Kristian Bonderup Pedersen, Kjeld Pedersen · IEEE Transactions on Power Electronics · 2015 · 95 citations

Engineering, Degradation Model, Mechanical Engineering +19

Bond wire lift-off in IGBT modules due to thermomechanical induced stress

Kristian Bonderup Pedersen, Kjeld Pedersen · 2012 · 42 citations

Engineering, Igbt Modules, Realistic Operation Conditions +19

Degradation Assessment in IGBT Modules Using Four-Point Probing Approach

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok et al. · IEEE Transactions on Power Electronics · 2014 · 36 citations

Electrical Engineering, Reliability Engineering, Engineering +15

A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application

Pramod Ghimire, Kristian Bonderup Pedersen, Angel Ruiz de Vega et al. · VBN Forskningsportal (Aalborg Universitet) · 2014 · 32 citations

Electrical Engineering, Wind Turbine System, Engineering +12