Kristian Bonderup Pedersen

A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations

Rui Wu, Huai Wang, Kristian Bonderup Pedersen et al. · IEEE Transactions on Industry Applications · 2016 · 120 citations · Full text

Engineering, Computational Engineering, Electrical Engineering +17

Dynamic Modeling Method of Electro-Thermo-Mechanical Degradation in IGBT Modules

Kristian Bonderup Pedersen, Kjeld Pedersen · IEEE Transactions on Power Electronics · 2015 · 97 citations

Engineering, Electrical Engineering, Materials Science +17

Bond wire lift-off in IGBT modules due to thermomechanical induced stress

Kristian Bonderup Pedersen, Kjeld Pedersen · 2012 · 44 citations

Engineering, Electrical Engineering, Materials Science +17

Degradation Assessment in IGBT Modules Using Four-Point Probing Approach

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok et al. · IEEE Transactions on Power Electronics · 2014 · 36 citations

Engineering, Electrical Engineering, Microelectronics +15

A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application

Pramod Ghimire, Kristian Bonderup Pedersen, Angel Ruiz de Vega et al. · VBN Forskningsportal (Aalborg Universitet) · 2014 · 32 citations

Engineering, Electrical Engineering, Heat Transfer +15