A novel technique for MEMS packaging: Reactive bonding with integrated material systems

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 457 citations

Engineering, Mechanical Engineering, Biomedical Engineering +16

Effect of intermixing on self-propagating exothermic reactions in Al/Ni nanolaminate foils

A. J. Gavens, D. Van Heerden, A. Mann et al. · Journal of Applied Physics · 2000 · 328 citations

Materials Engineering, Materials Science, Al/ni Nanolaminate Foils +14

A traction stress sensor array for use in high-resolution robotic tactile imaging

B.J. Kane, Mark R. Cutkosky, G.T.A. Kovacs · Journal of Microelectromechanical Systems · 2000 · 232 citations

Medical Electronics, Engineering, Mechanical Engineering +18

Room-temperature soldering with nanostructured foils

Jiaping Wang, E. Besnoin, A. Duckham et al. · Applied Physics Letters · 2003 · 220 citations

Friction Welding, Engineering, Nanostructured Surface +17

Modeling and characterizing the propagation velocity of exothermic reactions in multilayer foils

A. Mann, A. J. Gavens, M. E. Reiss et al. · Journal of Applied Physics · 1997 · 198 citations

Radiative Heat Transfer, Engineering, Propagation Velocity +26