Concepedia
Journal of Electronic Materials · 2006 · 25 citations · 15 references
Materials ScienceMaterials EngineeringEngineeringBga PackagesAdvanced Packaging (Semiconductors)Chip On BoardSurface ScienceApplied PhysicsChip AttachmentElectronic PackagingIntermetallic FormationMicrostructureCladding (Metalworking)
15
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations
Reliability, Electrical Engineering, Reliability Engineering +10
Foreword contributions from the 50th electronic components and technology conference
R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations
Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +8
Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
Iver E. Anderson, J. C. Foley, B. A. Cook et al. · Journal of Electronic Materials · 2001 · 211 citations
Materials Science, Materials Engineering, Engineering +7
Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
Jie Zhao, Lin Qi, Xiumin Wang et al. · Journal of Alloys and Compounds · 2004 · 179 citations
Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization
C. Y. Liu, K. N. Tu, T. T. Sheng et al. · Journal of Applied Physics · 2000 · 117 citations
Aluminium Nitride, Engineering, Thin Film Process Technology +19