Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Properties of lead-free solder alloys with rare earth element additions

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Materials Science and Engineering R Reports · 2004 · 587 citations

Natural Sciences, Materials Engineering, Materials Science +10

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

Dingfeng Yu, Jie Zhao, Li Wang · Journal of Alloys and Compounds · 2004 · 226 citations

Engineering, Materials Engineering, Materials Science +12

Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints

Z. G. Chen, Yao Shi, Zhidong Xia et al. · Journal of Electronic Materials · 2002 · 112 citations

Natural Sciences, Materials Engineering, Materials Science +14