Nano Letters · 2011 · 75 citations · 33 references
For advanced electronic, optoelectronic, or mechanical nanoscale devices a detailed understanding of their structural properties and in particular the strain state within their active region is of utmost importance. We demonstrate that X-ray nanodiffraction represents an excellent tool to investigate the internal structure of such devices in a nondestructive way by using a focused synchotron X-ray beam with a diameter of 400 nm. We show results on the strain fields in and around a single SiGe island, which serves as stressor for the Si-channel in a fully functioning Si-metal-oxide semiconductor field-effect transistor.
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Coherent X-ray diffraction imaging of strain at the nanoscale
Ian Robinson, Ross Harder · Nature Materials · 2009 · 678 citations
A 90-nm logic technology featuring strained-silicon
Scott E. Thompson, M Armstrong, C. Auth et al. · IEEE Transactions on Electron Devices · 2004 · 654 citations
Silicon Device Scaling to the Sub-10-nm Regime
M. Ieong, B. Doris, J. Kedzierski et al. · Science · 2004 · 564 citations
Device Speed, Electrical Engineering, Silicon Device Scaling +13