Journal of Applied Physics · 2005 · 37 citations · 14 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsChemical Vapor DepositionSemiconductor DefectsSemiconductor InterfacesSemiconductor NanomaterialsSemiconductor PhysicsSilicon MaterialsGrain Boundary DefectsHigh-resolution Transmission Electron MicroscopyMetal-organic Chemical Vapor DepositionNanopillarsSemiconductor NanostructuresSiliconSilicon NitrideStacking Faults In Semiconductors
Nanoheteroepitaxial growth of GaN by metal-organic chemical-vapor deposition on dense arrays of (111) Si nanopillars has been investigated. Scanning electron microscopy, cross-sectional transmission electron microscopy, and electron-diffraction analysis of 0.15-μm-thick GaN layers indicate single-crystal films. Most of the mismatch defects were in-plane stacking faults and the threading dislocation concentration was <108cm−2 at the interface and decreased away from the interface. High-resolution transmission electron microscopy indicated that grain-boundary defects could heal and were followed by high quality, single-crystal GaN. Facetted voids were also present at the GaN∕Si interface and are believed to be an additional strain-energy reduction mechanism. The unusual defect behavior in these samples appears to be related to the high compliance of the nanopillar silicon substrate.
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