Studies of thermosonic bonding for flip-chip assembly

Effects of Ultrasound on Deformation Characteristics of Metals

B. Langenecker · IEEE Transactions on Sonics and Ultrasonics · 1966 · 495 citations

Natural Sciences, Materials Engineering, Materials Science +12

The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics

G. G. Harman, John Albers · IEEE Transactions on Parts Hybrids and Packaging · 1977 · 203 citations

Natural Sciences, Materials Engineering, Materials Science +16

Review of the application of ultrasonic vibrations to deforming metals

A.E. Eaves, A. W. Smith, W.J. Waterhouse et al. · Ultrasonics · 1975 · 112 citations

Natural Sciences, Materials Engineering, Materials Science +12

A transmission electron microscopy study of ultrasonic wire bonding

James E. Krzanowski · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +17

LED array modules by new technology microbump bonding method

Kenzo HATADA, H. Fujimoto, Takafumi Ochi et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 54 citations

Engineering, Electrical Engineering, Materials Science +17