Statistics
Publications
1
Citations
75
H-Index
1
Active since
1995
Affiliations
University of Colorado Boulder(Current)
Y.C. Lee is an author at University of Colorado Boulder specializing in wafer bonding, flip-chip packaging, and thermal analysis.
Publications per year
1995–1995
1
1
Studies of thermosonic bonding for flip-chip assembly
Sa Yoon Kang, Paul M. Williams, T. McLaren et al. · Materials Chemistry and Physics · 1995 · 75 citations
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