Statistics
Publications
6
Citations
187
H-Index
6
Active since
1995
Affiliations
University of Colorado Boulder(Current)
T. McLaren is an author at University of Colorado Boulder specializing in engineering, flip-chip bonding, and bonding.
Publications per year
1995–2002
6
6
Studies of thermosonic bonding for flip-chip assembly
Sa Yoon Kang, Paul M. Williams, T. McLaren et al. · Materials Chemistry and Physics · 1995 · 75 citations
T. McLaren, Sa Yoon Kang, Wenge Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 48 citations
Thermosonic bonding for flip-chip assembly
Sa Yoon Kang, T. McLaren, Wenge Zhang et al. · 2002 · 21 citations
VCSEL/CMOS smart pixel arrays for free-space optical interconnects
John A. Neff, C. Chen, T. McLaren et al. · 2002 · 11 citations
Engineering, Computer Engineering, Electrical Engineering +17
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