Sa Yoon Kang

Studies of thermosonic bonding for flip-chip assembly

Sa Yoon Kang, Paul M. Williams, T. McLaren et al. · Materials Chemistry and Physics · 1995 · 75 citations

Engineering, Materials Engineering, Materials Science +10

Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array

T. McLaren, Sa Yoon Kang, Wenge Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 48 citations

Engineering, Electrical Engineering, Materials Science +17

Thermosonic bonding for flip-chip assembly

Sa Yoon Kang, T. McLaren, Wenge Zhang et al. · 2002 · 21 citations

Engineering, Electrical Engineering, Materials Science +14

A study on the chip-package-interaction for advanced devices with ultra low-k dielectric

Seok Won Lee, Byoung Wook Jang, Jong‐Kook Kim et al. · 2012 · 13 citations

Engineering, Materials Engineering, Materials Science +17

A study on wafer level molding for realizing 3-D integration

C S Lee, Euisun Choi, Un-Byoung Kang et al. · 2011 · 13 citations

Engineering, Manufacturing Engineering, Materials Engineering +16