Un-Byoung Kang

Fine pitch chip interconnection technology for 3D integration

Ji-Hwan Hwang, Jongyeon. Kim, Woon‐Seong Kwon et al. · 2010 · 52 citations

Engineering, Computer Engineering, Electronic Materials +16

A New COG Technique Using Low Temperature Solder Bumps for LCD Driver IC Packaging Applications

Un-Byoung Kang, Y.-H. Kim · IEEE Transactions on Components and Packaging Technologies · 2004 · 34 citations

Engineering, Electrical Engineering, Materials Engineering +14

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Min Ki Kim, Soojeoung Park, Aeni Jang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 30 citations

Engineering, Electrical Engineering, Materials Engineering +17

A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface

Bohee Hwang, Sanwi Kim, Jeong‐Hwan Lee et al. · 2023 · 17 citations

Engineering, Materials Engineering, Materials Science +16

Pt/Ti Thin Film Adhesion on SiN_x/Si Substrates

Un-Byoung Kang, Taegon Lee, Young-HoKim Young-HoKim · Japanese Journal of Applied Physics · 1999 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17