Concepedia

Aeni Jang

AJ

Statistics

Publications

4

Citations

76

H-Index

4

Active since

2021

Affiliations

Samsung (South Korea)(Current)

Aeni Jang is an author at Samsung (South Korea) specializing in microelectronics, electronic packaging, and engineering.

Top concepts

EngineeringApplied PhysicsMicroelectronicsElectronic PackagingSurface ScienceMaterial ScienceAdvanced PackagingComputer EngineeringComputer ArchitectureElectrical Engineering

Publications per year

2021–2024

4

Publications

4

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Min Ki Kim, Soojeoung Park, Aeni Jang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 27 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology

Sanghoon Lee, Youngkun Jee, Sangcheon Park et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 20 citations

Engineering, Hybrid Copper Bonding, Computer Architecture +19

The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability

Soohyun Nam, Younglyong Kim, Aeni Jang et al. · 2021 · 17 citations

Engineering, Device Integration, Mechanical Engineering +24

A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking

Hyeonmin Lee, Ji‐Hoon Kim, Min‐Ki Kim et al. · 2024 · 12 citations

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