Concepedia

Younglyong Kim

YK

Statistics

Publications

4

Citations

79

H-Index

4

Active since

2016

Affiliations

Samsung (South Korea)(Current)

Younglyong Kim is an author at Samsung (South Korea) specializing in electronic packaging, engineering, and computer architecture.

Top concepts

EngineeringElectronic PackagingMicroelectronicsMicrofabricationAdvanced PackagingComputer EngineeringComputer ArchitectureMechanical EngineeringHeterogeneous IntegrationThree-dimensional Heterogeneous Integration

Publications per year

2016–2023

4

Publications

4

Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology

Ilbok Lee, Soohyun Nam, Sung‐Eun Kim et al. · 2023 · 22 citations

Artificial Intelligence, Engineering, Device Integration +20

Investigation on Package Warpage and Reliability of the large size 2.5D Molded Interposer on Substrate (MIoS) Package

Soohyun Nam, Jinhyun Kang, Ilbok Lee et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 21 citations

Engineering, Device Integration, Mechanical Engineering +22

Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package

Younglyong Kim, Tae‐Ik Lee, Jihye Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 19 citations

Engineering, Mechanical Engineering, Bending Properties +20

The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability

Soohyun Nam, Younglyong Kim, Aeni Jang et al. · 2021 · 17 citations

Engineering, Device Integration, Mechanical Engineering +24

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