Concepedia

Youngkun Jee

YJ

Statistics

Publications

3

Citations

63

H-Index

3

Active since

2022

Affiliations

Samsung (South Korea)(Current)

Youngkun Jee is an author at Samsung (South Korea) specializing in microelectronics, engineering, and electrical engineering.

Top concepts

Publications per year

2022–2023

3

Publications

3

Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

Min Ki Kim, Soojeoung Park, Aeni Jang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 27 citations

, , +15

A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology

Sanghoon Lee, Youngkun Jee, Sangcheon Park et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 20 citations

, , +19

A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface

Bohee Hwang, Sanwi Kim, Jeong‐Hwan Lee et al. · 2023 · 16 citations

, , +19

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