Large deformation and geometric instability of substrates with thin-film deposits

M. Finot, I. A. Blech, S. Suresh, +1

Journal of Applied Physics

EngineeringSevere Plastic DeformationMechanical EngineeringWafer Scale ProcessingStressstrain Analysis +18

High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction

Nobumichi Tamura, Alastair A. MacDowell, Richard Celestre, +9

Applied Physics Letters

X-ray SpectroscopyEngineeringSevere Plastic DeformationMicroscopyX-ray Synchrotron Technique +18

Thin Film Cracking and Ratcheting Caused by Temperature Cycling

Min Huang, Zhigang Suo, Qing Ma, +1

Journal of materials research/Pratt's guide to venture capital sources

Materials ScienceEngineeringMechanical EngineeringThin Film CrackingCold Working +8

Local Plasticity of Al Thin Films as Revealed by X-Ray Microdiffraction

Ralph Spolenak, W. L. Brown, Nobumichi Tamura, +9

Physical Review Letters

Aluminium NitrideEngineeringSevere Plastic DeformationGrain SizeAl Thin Films +17

LED array modules by new technology microbump bonding method

Kenzo HATADA, H. Fujimoto, Takafumi Ochi, +1

IEEE Transactions on Components Hybrids and Manufacturing Technology

Optical MaterialsEngineeringOptoelectronic DevicesIntegrated CircuitsElectronic Devices +18

Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures

Qing Ma, H. Fujimoto, Paul A. Flinn, +4

MRS Proceedings

Materials ScienceEngineeringInterface Fracture EnergyApplied PhysicsDynamic Crack Propagation +8

Adhesion Measurement of Interfaces in Multilayer Interconnect Structures

Qing Ma, John Bumgarner, H. Fujimoto, +2

MRS Proceedings

Interface StructureEngineeringMicrofabricationMechanical EngineeringApplied Physics +5

A new LSI bonding technology 'Micron bump bonding assembly technology'

Kenzo HATADA, H. Fujimoto, T. Kawakita, +1

EngineeringDevice IntegrationMechanical EngineeringIntegrated CircuitsLsi Chip +16

Developing design rules to avert cracking and debonding in integrated circuit structures

X.H. Liu, Zhigang Suo, Qing Ma, +1

Engineering Fracture Mechanics

Physical Design (Electronics)EngineeringCircuit DesignElectronic Design AutomationIntegrated Circuit Structures +10

Mechanical behaviour of submicron multilayers submitted to microtensile experiments

Maria Ignat, T. Marieb, H. Fujimoto, +1

Thin Solid Films

EngineeringMicromechanicsMechanical PropertiesMicrofabricationMechanical Engineering +6