Concepedia

Kenzo HATADA

KH

Statistics

Publications

5

Citations

139

H-Index

5

Active since

1987

Affiliations

Panasonic (Japan)(Current)

Kenzo HATADA is an author at Panasonic (Japan) specializing in engineering, electrical engineering, and semiconductor devices.

Publications per year

1987–2003

5

Publications

5

LED array modules by new technology microbump bonding method

Kenzo HATADA, H. Fujimoto, Takafumi Ochi et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 54 citations

Engineering, Electrical Engineering, Materials Science +17

A new LSI bonding technology 'Micron bump bonding assembly technology'

Kenzo HATADA, H. Fujimoto, T. Kawakita et al. · 1988 · 32 citations

Engineering, Electrical Engineering, Materials Science +16

Impacts of antenna layout enhanced charging damage on MOSFET reliability and performance

Takayuki Yamada, Koji Eriguchi, Y. Kosaka et al. · 2002 · 23 citations

Engineering, Electrical Engineering, Physics +16

New Film Carrier Assembly Technology: Transferred Bump TAB

Kenzo HATADA, H. Fujimoto, Koichi Matsunaga · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1987 · 17 citations

Engineering, Electrical Engineering, Manufacturing Engineering +13

A new LSI bonding technology 'micron bump bonding technology'

Kenzo HATADA, H. Fujimoto · Proceedings., 39th Electronic Components Conference · 2003 · 13 citations

Engineering, Electrical Engineering, Materials Science +16

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