Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder - Concepedia

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Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder

43

Citations

21

References

2014

Year

A.A. El-Daly, T.A. Elmosalami, W. M. Desoky, M.G. El-Shaarawy, A.M. Abdraboh

Materials Science and Engineering A

Materials EngineeringMaterials ScienceEngineeringPowder MetallurgyMechanical EngineeringNano-sized Zno ParticlesTensile Deformation BehaviorSn–3.0ag–0.5cu Lead-free SolderMicrostructure

References

	Year	Citations

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