A.E. Hammad

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 152 citations

Materials Science, Materials Engineering, Engineering +7

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

A.A. El-Daly, A.E. Hammad · Materials & Design (1980-2015) · 2012 · 135 citations

Materials Science, Materials Engineering, Creep Resistance +6

Creep properties of Sn–Sb based lead-free solder alloys

A.A. El-Daly, Y. Swilem, A.E. Hammad · Journal of Alloys and Compounds · 2008 · 115 citations

Materials Engineering, Materials Science, Engineering +3

Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

A.E. Hammad · Materials & Design (1980-2015) · 2013 · 97 citations

Materials Science, Materials Engineering, Engineering +6

Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

A.A. El-Daly, A.E. Hammad · Journal of Alloys and Compounds · 2011 · 94 citations

Materials Science, Materials Engineering, Engineering +4