A.A. El-Daly

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 152 citations

Materials Science, Materials Engineering, Engineering +7

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

A.A. El-Daly, A.E. Hammad · Materials & Design (1980-2015) · 2012 · 135 citations

Materials Science, Materials Engineering, Creep Resistance +6

Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

A.A. El-Daly, A. M. El-Taher, Shimaa Gouda · Journal of Alloys and Compounds · 2014 · 132 citations

Materials Engineering, Materials Science, Electrical Engineering +2

Creep properties of Sn–Sb based lead-free solder alloys

A.A. El-Daly, Y. Swilem, A.E. Hammad · Journal of Alloys and Compounds · 2008 · 115 citations

Materials Engineering, Materials Science, Engineering +3

Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

A.A. El-Daly, Y. Swilem, M.H. Makled et al. · Journal of Alloys and Compounds · 2009 · 109 citations

Materials Science, Materials Engineering, Engineering +5