A. Fawzy

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

A.A. El-Daly, A. Fawzy, A.Z. Mohamad et al. · Journal of Alloys and Compounds · 2011 · 95 citations

Natural Sciences, Materials Engineering, Materials Science +13

Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy

A.A. El-Daly, G.S. Al-Ganainy, A. Fawzy et al. · Materials & Design (1980-2015) · 2013 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +17

Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance

A.A. El-Daly, A. Fawzy, S.F. Mansour et al. · Materials Science and Engineering A · 2013 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +12

Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

A.A. El-Daly, A. Fawzy, S.F. Mansour et al. · Journal of Materials Science Materials in Electronics · 2013 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +17