Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

Creep deformation characteristics of tin and tin-based electronic solder alloys

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Natural Sciences, Materials Engineering, Materials Science +14

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

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Natural Sciences, Materials Engineering, Materials Science +12

Creep properties of Sn–Sb based lead-free solder alloys

A.A. El-Daly, Y. Swilem, A.E. Hammad · Journal of Alloys and Compounds · 2008 · 119 citations

Natural Sciences, Materials Engineering, Materials Science +14

Phase Equilibria of the Sn-Sb Binary System

Sinn-wen Chen, Chih-Chi Chen, Wojciech Gierlotka et al. · Journal of Electronic Materials · 2008 · 113 citations

Natural Sciences, Materials Science, Physics +14

Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys

A.A. El-Daly, Y. Swilem, M.H. Makled et al. · Journal of Alloys and Compounds · 2009 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +12