Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy

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Natural Sciences, Materials Engineering, Materials Science +16

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L.C. Tsao, Shih‐Ying Chang · Materials & Design (1980-2015) · 2009 · 181 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

Wenhui Zhu, Edith S. W. Poh, X.W. Zhang et al. · Journal of Alloys and Compounds · 2010 · 151 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

Ping Liu, Pei Yao, Jim Liu · Journal of Electronic Materials · 2008 · 146 citations

Natural Sciences, Materials Engineering, Materials Science +14