Publication | Closed Access
Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy
143
Citations
19
References
2008
Year
Materials EngineeringMaterials ScienceEngineeringPowder MetallurgyNanomaterialsNanotechnologySic Nanoparticle AdditionsMechanical EngineeringAlloy DesignCarbideSn-ag-cu Solder AlloyMicrostructure
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