Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles - Concepedia

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Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

70

Citations

16

References

2013

Year

A.A. El-Daly, A. Fawzy, S.F. Mansour, M.J. Younis

Journal of Materials Science Materials in Electronics

Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyMechanical EngineeringThermal AnalysisCarbideSic Nano-sized ParticlesSn–1.0ag–0.5cu Solder AlloyMicrostructure

References

	Year	Citations

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