Y.C. Pan - Concepedia

Author

Y.C. Pan

Also Known As

PAN Yifeng, Y. C. Pan, Y.C. Pan

Publications

361

Citations

H-Index

Concepts

All Affiliations

Y.C. Pan is an author at South China University of Technology specializing in engineering, materials science, and nanomaterials.

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	355
2	Materials Science	5	5	355
3	Chemical Engineering	3	3	168
4	Materials Engineering	2	2	153
5	Mechanical Engineering	2	2	187

Y.C. Pan

Publications

355

Citations

H-Index

Page 1

	Year	Citations
Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder Yu Tang, G.Y. Li, Y.C. Pan Materials & Design (1980-2015) Materials ScienceEngineeringPowder MetallurgyMechanical PropertiesMechanical Engineering	2013	136
Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process Yu Tang, G.Y. Li, Y.C. Pan Journal of Alloys and Compounds Materials ScienceMaterials EngineeringChemical EngineeringTio2 NanoparticlesImc Growth	2012	102
Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints Yu Tang, Shuqiong Luo, W.F. Huang, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringMechanical PropertiesNanomaterials	2017	51
Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process Yu Tang, G. Y. Li, D. Q. Chen, Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringTio2 NanoparticlesImc GrowthEngineering	2013	38
Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder Yu Tang, Y.C. Pan, G. Y. Li Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringTio2 NanoparticlesSinteringEngineering	2012	28

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