Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process - Concepedia

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Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process

38

Citations

22

References

2013

Year

Yu Tang, G. Y. Li, D. Q. Chen, Y.C. Pan

Journal of Materials Science Materials in Electronics

Materials ScienceChemical EngineeringTio2 NanoparticlesImc GrowthEngineeringSn–3.0ag–0.5cu–xtio2 Solder JointsPowder SynthesisMicrostructureMaterial Preparation

References

	Year	Citations

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