G. Y. Li - Concepedia

Author

G. Y. Li

South China University of Technology ORCID

Also Known As

G. Li, G. Y. Li, G.Y. Li, Gaobiao Li, Genke Li, Guanlue Li, Li, Guanlue

Publications

563

Citations

H-Index

Concepts

All Affiliations

South China University of Technology Zhongkai University of Agriculture and Engineering Ministry of Industry and Information Technology South China Agricultural University Jilin University

About

G. Y. Li is an author at South China University of Technology specializing in engineering, materials science, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	10	435
2	Applied Physics	4	4	273
3	Chemical Engineering	4	4	260
4	Chemistry	2	2	232
5	Electrical Engineering	1	1	47

G. Y. Li

Publications

532

Citations

H-Index

Page 1

	Year	Citations
Mono-sized single-wall carbon nanotubes formed in channels of AlPO4-5 single crystal Zi Kang Tang, Handong Sun, Jiannong Wang, Applied Physics Letters Materials ScienceChemical EngineeringEngineeringCarbon-based MaterialNanomaterials	1998	184
Fabrication and characterization of polycaprolactone/calcium sulfate whisker composites J. Y. Liu, L. Reni, Qiang Wei, eXPRESS Polymer Letters	2011	81
Carbon nanotubes synthesised in channels of AlPO4-5 single crystals: first X-ray scattering investigations Pascale Launois, R. Moret, D. Le Bolloc’h, Solid State Communications Materials ScienceEngineeringCarbon-based MaterialNanomaterialsNanotechnology	2000	48
Degradation Behavior and Mechanisms of E-Mode GaN HEMTs With p-GaN Gate Under Reverse Electrostatic Discharge Stress Yiqiang Chen, Jingtai Feng, J. L. Wang, IEEE Transactions on Electron Devices Wide-bandgap SemiconductorTransmission Line PulseElectrical EngineeringE-mode Gan HemtsEngineering	2020	47
Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process Yu Tang, G. Y. Li, D. Q. Chen, Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringTio2 NanoparticlesImc GrowthEngineering	2013	38
Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints G. Y. Li, Xiumei Bi, Qianwang Chen, Journal of Electronic Materials Materials ScienceMaterials EngineeringFriction WeldingEngineeringIntermetallic Layers	2010	31
Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder Yu Tang, Y.C. Pan, G. Y. Li Journal of Materials Science Materials in Electronics Materials ScienceChemical EngineeringTio2 NanoparticlesSinteringEngineering	2012	28
Effects of titanium on active bonding between Sn3.5Ag4Ti(Ce,Ga) alloy filler and alumina Lanxian Cheng, G. Y. Li, Zhenlong Li, Journal of Materials Science Materials in Electronics Materials ScienceMaterials EngineeringEngineeringSuperalloyCorrosion	2015	23
Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the Taguchi method Yu Tang, Si‐Chun Luo, G. Y. Li, Microelectronics Journal	2018	16
Effect of nano-TiO2 addition on microstructural evolution of small solder joints Zhenlong Li, G. Y. Li, Lanxian Cheng, Journal of Materials Science Materials in Electronics Materials ScienceNano-tio2 AdditionMaterials EngineeringEngineeringMechanical Engineering	2016	15

Page 1