Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

Deformation and Fracture Mechanics of Engineering Materials

Richard W. Hertzberg, F. Hauser · Journal of Engineering Materials and Technology · 1977 · 3.7K citations · Full text

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Mechanical behavior of materials

Choice Reviews Online · 1990 · 1.9K citations · Full text

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee et al. · Materials & Design (1980-2015) · 2010 · 205 citations

Materials Science, Materials Engineering, Engineering +10

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L.C. Tsao, Shih‐Ying Chang · Materials & Design (1980-2015) · 2009 · 181 citations

Materials Science, Materials Engineering, Sn3.5ag0.25cu Solder +10

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Mui Ling Sharon Nai, Jun Wei, Manoj Gupta · Materials Science and Engineering A · 2006 · 152 citations

Materials Science, Reinforcement Material, Engineering +6