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Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

DOI

136

Citations

20

References

2013

Year

Yu Tang, G.Y. Li, Y.C. Pan
Materials & Design (1980-2015)

References

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1977

3.7K

Mechanical behavior of materials

Choice Reviews Online

1990

1.9K

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee,

Materials & Design (1980-2015)

2010

205

Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

L.C. Tsao, Shih‐Ying Chang

Materials & Design (1980-2015)

2009

181

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Mui Ling Sharon Nai, Jun Wei, Manoj Gupta

Materials Science and Engineering A

2006

152

Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

Ping Liu, Pei Yao, Jim Liu

Journal of Electronic Materials

2008

143

New, creep-resistant, low melting point solders with ultrafine oxide dispersions

H. Mavoori, S. Jin

Journal of Electronic Materials

1998

125

Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Shih‐Ying Chang, Chao‐Chi Jain, Tung‐Han Chuang,

Materials & Design (1980-2015)

2011

123

Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

L.C. Tsao, Chia-Wei Huang, Chin-Sung Chung,

Materials Science and Engineering A

2012

121

Composite lead-free electronic solders

Fu Guo

Journal of Materials Science Materials in Electronics

2006

115

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