Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

Chih Chen, Hua-Ching Tong, K. N. Tu · Annual Review of Materials Research · 2010 · 285 citations

Engineering, Electrical Engineering, Materials Engineering +17

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y.C. Chan, Daoguo Yang · Progress in Materials Science · 2010 · 275 citations

Engineering, Electrical Engineering, Materials Engineering +17

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 267 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Hua Ye, Cemal Basaran, Douglas C. Hopkins · Applied Physics Letters · 2003 · 243 citations

Engineering, Electrical Engineering, Materials Engineering +17