2003 · 15 citations · 4 references
EngineeringElectrical EngineeringCircuit TheoryMicroelectronicsSemiconductor DevicesChip PackagingCurrent-voltage CharacteristicsDevice CharacterizationDevice SimulationElectrical CharacterizationIntegrated Circuit DesignCharged Device ModelCircuit SimulationElectrical TestabilityElectrostatic DischargeElectrostatic Discharge SimulationElectrostatic Discharge TestingPackage ModelingPackaging Effects Characterization
The electrostatic discharge (ESD) sensitivity of integrated circuits with respect to the charged device model depends strongly on the package. Electrical characteristics of a package are, if at all extracted, application specific. They depend on the environment e.g. the PCB. This paper characterises the package for the 1st time taking into account the CDM tester environment. The extracted parameters are a prerequisite for circuit simulation of integrated circuits under CDM-stress
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Parameterized models for a RF chip-to-substrate interconnect
I. Doerr, Lih‐Tyng Hwang, G. Sommer et al. · 2001 · 31 citations
Engineering, Electrical Engineering, Computational Electromagnetics +15
Horst Gieser, Heinrich Wolf, Wolfgang Soldner et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2003 · 14 citations